■ Anti-Static Protection Performance
Made from professional-grade anti-static IXPE foam, the material helps reduce static charge accumulation and the risk of electrostatic discharge, providing protection for precision electronic components and products.
■ Stable Anti-Static Surface Resistance
The foam has a surface resistance range of 10⁶–10⁹ Ω, providing stable anti-static performance and meeting the requirements of electronics manufacturing and precision packaging applications.
■ Electron-Beam Crosslinked Technology
Produced using electron-beam crosslinking (IXPE) technology rather than conventional chemical crosslinking processes. The manufacturing process does not use chemical blowing agents, resulting in a more uniform and fine-cell material structure.
■ Fine Cell Structure & Excellent Cushioning
IXPE foam features a fine, uniform cell structure with excellent cushioning, shock absorption, and impact resistance, helping protect products during transportation and storage.
■ Lightweight, Durable & Stable Processing
The material is lightweight while providing excellent compression and abrasion resistance. It can be processed through die cutting, lamination, molding, CNC machining, and customized forming.
■ Wide Range of Electronics Applications
Widely used for electronic components, semiconductors, precision instruments, tool storage, and anti-static packaging.
Suitable Product Types
Ideal for:
- Anti-Static IXPE Foam
- Electronic Component Trays
- ESD Trays
- Tool Case Foam Inserts
- Protective Packaging for Precision Instruments
- Semiconductor Component Packaging Materials
- Anti-Static Cushioning Materials
- Customized IXPE Molded Products